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Difference between revisions of "Reference Development Kit"

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* [[RFDIO|RFDIO Interface]]
 
* [[RFDIO|RFDIO Interface]]
 
* [https://myriadrf.org/projects/rdk/ Reference Development Kit Project Page]
 
* [https://myriadrf.org/projects/rdk/ Reference Development Kit Project Page]
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Revision as of 15:00, 15 September 2015

1 About

The Reference Development Kit is comprised of three individual hardware devices: the Myriad-RF 1, the DE0-Nano Interface Board, and the Zipper Interface Board. The Myriad-RF 1 communicates with one of these two boards via the Radio Frequency Digital Input Output (RFDIO) interface.

2 Myriad-RF 1

Myriadrf1-1.jpg

The Myriad-RF 1 is a low cost universal radio development platform, based on flexible, multi standard LMS6002DFN transceiver and Altera FPGA module. It enables developers to implement their products for a wide variety of wireless communication applications efficiently. It is designed to be used with either the Digital Interface Board or the Zipper Interface Adapter.

3 DE0-Nano Interface Board

DE0-Nano-Interface-Board-1.jpg

The DE0-Nano Interface Board allows the Myriad-RF 1 to be connected to the DE0-Nano FPGA Development System, adding radio functionality to the system. It cannot be used with other FPGA development systems; for anything other than the DE0-Nano FPGA Development System, the Zipper Interface Board should be used instead.

4 Zipper Interface Board

Zipper-1.jpg

The Zipper Interface Board allows the Myriad-RF 1 to be connected to any FPGA development system supporting the High-Speed Mezzanine Card (HSMC) or FPGA Mezzanine Card (FMC) standards, adding radio functionality to the system. The multi-platform compatibility of the Zipper Interface Board makes it suitable for a wide range of FPGA development systems from manufacturers including Altera and Xilinx.

5 RFDIO Interface

RFDIO-Card-Connector-1.jpg

The RFDIO Interface provides high-speed connectivity to FPGA-based carrier boards, including the Digital Interface Board and the Zipper Interface Board of the Reference Development Kit. It is based on the Hirose 0.5mm-pitch, 80-position surface-mount connector, and ensures interoperability between carrier boards and RF cards. The femail connector is located on the motherboard, while the male connector is located on the daughterboard.

6 See Also